Sign In | Join Free | My himfr.com
Home > Sensors Substrate >

Fingerprint sensors packaging substrate manufacture supporting

HongRuiXing (Hubei) Electronics Co.,Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap Fingerprint sensors packaging substrate manufacture supporting from wholesalers
     
    Buy cheap Fingerprint sensors packaging substrate manufacture supporting from wholesalers
    • Buy cheap Fingerprint sensors packaging substrate manufacture supporting from wholesalers

    Fingerprint sensors packaging substrate manufacture supporting

    Ask Lasest Price
    Brand Name : Horexs
    Certification : UL
    Price : US 120-135 square meter
    Payment Terms : L/C, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 30000 square meters per month
    Delivery Time : 7-10 working days
    • Product Details
    • Company Profile

    Fingerprint sensors packaging substrate manufacture supporting

    Application:IoT electronics,Home electronics,Consumer electronics,Car electronics,Smart electronics;

    Spec.of Substrate production:

    Mini.Line space/width:1mil (25um)

    Finished thickness:BT (0.1-0.4mm) finished thickness;

    Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

    Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

    Copper:0.5oz or Customize;

    Layer:1-6 layer (Customize);

    Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

    Short introduction of Horexs Manufacturer:

    HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.


    When you send inquiry us,Pls be know that we have to get the following :

    1-Substrate production sepc. information;

    2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

    3-Quantity request,Including sample;

    4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;


    Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!


    Want Better price,Better quality Substrate ? Contact Horexs now!


    Shipping supporting:

    DHL/UPS/Fedex;

    By air;

    Customize express(DHL/UPS/Fedex)

    Quality Fingerprint sensors packaging substrate manufacture supporting for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: HongRuiXing (Hubei) Electronics Co.,Ltd.
    *Subject:
    *Message:
    Characters Remaining: (0/3000)