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BT material semiconductor Pacakge Substrate L/S 35/35um

HongRuiXing (Hubei) Electronics Co.,Ltd.
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    Buy cheap BT material semiconductor Pacakge Substrate L/S 35/35um from wholesalers
     
    Buy cheap BT material semiconductor Pacakge Substrate L/S 35/35um from wholesalers
    • Buy cheap BT material semiconductor Pacakge Substrate L/S 35/35um from wholesalers

    BT material semiconductor Pacakge Substrate L/S 35/35um

    Ask Lasest Price
    Brand Name : Horexs
    Model Number : HRX
    Certification : UL
    Price : US 120-150 per square meter
    Payment Terms : Western Union, MoneyGram, T/T, L/C
    Supply Ability : 30000 square meters per month
    Delivery Time : 7-10 working days
    • Product Details
    • Company Profile

    BT material semiconductor Pacakge Substrate L/S 35/35um

    BOC pacakge substrate manufacture with short delivery time


    Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package;


    Spec.of pcb production:

    Mini.Line space/width1mil (20um)
    Finished thicknessBT (0.1-0.4mm) finished thickness
    Mainly brandSHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others
    Surface finishedMainly immersion gold,ENEPIG,support customize such as OSP/Immersion silver,tin,more
    Copper0.5oz or Customize
    Layer1-6 layer (Customize)
    Soldermaskreen or Customize (Brand:Soldermask:TAIYO INK,ABQ)
    Improved tenting process20/20um

    Short introduction of Horexs Manufacturer:

    HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.


    When you send inquiry us,Pls be know that we have to get the following :

    1-Substrate production sepc. information;

    2-Gerber files(substrate designer/engineer can export it from your layout software,also send us drilling file)

    3-Quantity request,Including sample;

    4-Multilayer substrate,please also provide us layer stack-up information;


    Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!


    Want Better price,Better quality substrate? Contact Horexs now!


    Shipping supporting:

    DHL/UPS/Fedex;

    By air;

    Customize express(DHL/UPS/Fedex)

    Quality BT material semiconductor Pacakge Substrate L/S 35/35um for sale
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