Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless RF-Memory (DDR SDRAM)-Cell phone-Workstation, Server, Video Camera -Desktop PC, Note book PC,Wearable electronics,Car/automotive electronics;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage;

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.29mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:10-15um or Customize;

Layer:4 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK)

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

Process Capability
Our Technology
• Fine pattern by MSAP(20/20um) and Tenting(30/30um)
• Various Applicable Technical Option
- Thin Core Technology
- All type Surface Finish
- SR Flatness Process, Build up / Via Filling Tech.
- Tailless, Etch-back Process
- Fine Pitch SOP process
• High Quality and Reliability Substrate
• High Speed Delivery : No need film, No outsourcing
• Competitive Low Running Cost

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality substrate ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

HOREXS Group was located in CHINA mainland,has three subsidiaries:Boluo HongRuiXing Electronics Co., Ltd(Located in Huizhou city GuangDong),HongRuiXing (HuBei) Electronics Co.,Ltd(Located in HuBei province),Horexs Electronics (HK) Co.,Ltd(Located in HK),All are just located in difference place to meet our customers demand of ic substrate manufacture.Horexs supplies different kinds of IC substrate products. High quality and favorable price. We're pleased to get your Inquiry and we will come back to as soon as possible. We  stick to the principle of "quality first, service first, continuous improvement and innovation to meet the customers" for the management and "zero defect, zero complaints" as the quality objective. To perfect our service, we provide the products with good quality at the reasonable price.

HOREXS Huizhou Built in 2009 

Capacity 15000sqm/Month,Tenting process,BT materials,L/S 35/35um,

Mainly memory(BGA) substrates,parts of MEMS/CMOS/MiniLED/Sip/FCCSP package substrates and others ultra thin substrate.

HOREXS Hubei Built in 2020

HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memory IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

Horexs is a professional advanced semiconductors electronics packaging material manufacturer of semiconductor packaging substrate; Horexs's Products are widely used in IC assembly&Semiconductor package(Sip/CSP/FCCSP/PBGA/LGA/FBGA/MEMS/CMOS/RF Module etc).Such as Micro SD substrate,Sensor substrate,FCCSP package substrate,Fingerprint card substrate and other ultra thin substrate.

Horexs was founded in 2010, a total investment of ten million yuan, now has more than 20 professional technical personnel, engineering management and technical personnel more than 100 be trained with regularity, the monthly production capacity of 3000 square meters, plant a total area of 10000 square meters, including printing, electronic measurement, testing workshop dust-free workshop according to the construction of high standard; In order to meet the needs of high precision circuit board configuration Hitachi high-speed drilling machine, automatic electroplating production line, printing, exposure, development, etching, laminated, gold, gold, high standard NC a full set of production equipment; To ensure that the product qualified rate one hundred percent, electrical measuring machine, flying probe test, testing equipment for physical or chemical analysis room; Set up sewage treatment station and environmental protection exhaust gas treatment system, the heavy metals by ion exchange of organic waste water, complex, activated carbon filtration, chemical precipitation method to realize effective treatment discharge standards and a series of advanced technology.

Horexs adhere to high quality products, fast delivery, perfect service, good reputation, flexible marketing as the foundation of the market competition; To win in the Pearl River Delta and overseas customers trust and support. Also look forward to working with our new customer cooperation, achieve a win-win situation, create a better future!