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semiconductor FCCSP Package Substrate manufacture

HongRuiXing (Hubei) Electronics Co.,Ltd.
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    Buy cheap semiconductor FCCSP Package Substrate manufacture from wholesalers
     
    Buy cheap semiconductor FCCSP Package Substrate manufacture from wholesalers
    • Buy cheap semiconductor FCCSP Package Substrate manufacture from wholesalers

    semiconductor FCCSP Package Substrate manufacture

    Ask Lasest Price
    Brand Name : Horexs
    Certification : UL
    Price : US 85-100 per square meter
    Payment Terms : L/C, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 30000 square meters per month
    Delivery Time : 7-10 working days
    • Product Details
    • Company Profile

    semiconductor FCCSP Package Substrate manufacture

    Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others;

    Spec.of Substrate production:

    Mini.Line space/width:1mil (25um)

    Finished thickness:0.3mm;

    Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

    Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

    Copper:10-15um or Customize;

    Layer:1-6 layer (Customize);

    Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)


    Short introduction of Horexs Manufacturer:

    HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.


    When you send inquiry us,Pls be know that we have to get the following :

    1-Substrate production sepc. information;

    2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

    3-Quantity request,Including sample;

    4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;


    Process Capability
    Our Technology
    • Fine pattern by MSAP(20/20um) and Tenting(30/30um)
    • Various Applicable Technical Option
    - Thin Core Technology
    - All type Surface Finish
    - SR Flatness Process, Build up / Via Filling Tech.
    - Tailless, Etch-back Process
    - Fine Pitch SOP process
    • High Quality and Reliability Substrate
    • High Speed Delivery : No need film, No outsourcing
    • Competitive Low Running Cost


    Shipping supporting:

    DHL/UPS/Fedex;

    By air;

    Customize express(DHL/UPS/Fedex)

    Quality semiconductor FCCSP Package Substrate manufacture for sale
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